Thermal management is important aspect of RRH design. The heat generated  from the IC’s has to be removed and dissipated efficiently in order to maintain the recommended working temperate of IC’s. In  the current  generation RRH (5G rrh)the  antennas are integrated into the RRH as a single unit, resulting in reduced surface area for heat dissipation which was a tough problem given that the increased power density from previous generation due to tighter packaging and  the limitation  of not to use active cooling concerning reliability and servicability .

We work on the thermal design which involves calculating, designing,simulating and manufacturing of heatsinks required for each board. We also  work on the over all design  and  packaging  of the RRH satisfying each team and other required standards.